| http://etasmt.com/te_news_bulletin/2021-09-02/24963.chtml
; because none of them are exact drop-in replacements for tin/lead solder, all require some process adjustments. The primary difference between most of the new formulations and traditional solder is a higher melting point
| http://etasmt.com:9060/te_news_bulletin/2021-09-02/24963.chtml
; because none of them are exact drop-in replacements for tin/lead solder, all require some process adjustments. The primary difference between most of the new formulations and traditional solder is a higher melting point
| http://etasmt.com/te_news_industry/2021-09-01/24162.chtml
window is 195-240 degrees. Because of the change of melting point of lead-free solder paste , lead-free soldering has brought great changes for soldering process
| http://etasmt.com:9060/te_news_industry/2021-09-01/24162.chtml
window is 195-240 degrees. Because of the change of melting point of lead-free solder paste , lead-free soldering has brought great changes for soldering process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/auto-nozzle-tinning
: 1.59 mm (0.062 in.) Solder melting point: 227°C (441°F) Solder density: 7.31 grams/cm3 Flux type: RZ1-H7A (4.5%) Spool weight: 0.45 kg (1.0 lbs.) Application Note The Nordson SELECT Automatic Solder Nozzle Tinning System can be adapted to all Nordson SELECT Novo
| http://etasmt.com/te_news_bulletin/2020-03-28/14961.chtml
. The second is the application of solder alloys with different melting points. The alloy with a higher melting point is used for the first side and the alloy with a lower melting point is used for the second side
| http://etasmt.com/cc?ID=te_news_industry,24564&url=_print
. Compared the SnPb solder , the melting point of lead-free solder alloy is higher and more difficult to wet. The preheat temperature is too low or the flux is inactive
| https://www.eptac.com/the-5-essential-tools-for-soldering/
. Keep in mind that the solder should have a lower melting point than the materials that are being joined. This will allow the solder to melt first and bond the materials together
| https://www.eptac.com/do-you-know-all-of-the-applications-for-soldering/
. This process also requires a blowtorch to achieve the temperatures at which the solder melts. Brazing (>450 °C) [>842 o F] This type of soldering uses a metal with a much higher melting point than those used in hard and soft soldering
| http://etasmt.com:9060/te_news_industry/2013-07-03/5361.chtml
: it will not immediately be transferred to a lead-free system in a short time, so the lead may still be used in PCB pads and component terminals, such as doped solder ,may cause the melting point of
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