| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
. Check the plating in the barrels to make sure there are no voids. See IPC-600 for the criteria. Plating voids will have a tendency to create out gassing and therefore create voids in the solder joints
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
Now acceptable wire wrap criteria 19 001 Changes No more text boxes 20 001 Changes New: Table 3-1 Maximum Limits of Solder Bath Contaminant to accommodate the new lead-free solders Section
| https://www.eptac.com/webinar/tempered-leads-class-3-rework-toe-fillets-and-more/
. During this webinar, we would like to share some of the issues that other production people are running into, some common problems and not so common
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more/
. During this webinar, we would like to share some of the issues that other production people are running into, some common problems and not so common
| https://www.eptac.com/webinars/tempered-leads-class-3-rework-toe-fillets-and-more
. During this webinar, we would like to share some of the issues that other production people are running into, some common problems and not so common
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_21_09.pdf
. 17 IPC-A-610, Clarification of Wetting Climb Recommendation to add illustrations from the 620A tng slide that depicts solder climb and solder depression50% climb75% climb100% climb W 50% climb 75% climb 100
| https://www.eptac.com/soldertips/defining-shear-forces-for-surface-mounted-components/
. The DOE modifications could be profile temp changes, paste deposition thickness changes, paste material changes, etc. The reliability of the solder joint is not based upon the how much shear force is required to break the solder joint, but how it is designed for the environment of the operational product
| https://www.eptac.com/faqs/soldertips?hsLang=en
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Read More SolderTips
| https://www.eptac.com/faqs/soldertips
: “A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly”... Read More SolderTips
| https://www.eptac.com/webinars/page/2
: When Gold Removal is a Must Length: 31 Minutes We hear/are asked this question all the time. When do I need to remove gold plating and why do I have too
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