ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-de/divisions/efd/resources/solder-faqs
verstärken. Der niedrige Sauerstoffgehalt verzögert die Oxidation und ermöglicht längere und heißere Profile. Stickstoff überträgt Wärme besser als Luft, daher können die Sollwerte niedriger sein. Die Verdunstung vieler flüssiger Flussmittelbestandteile wird
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/solder-frequently-asked-questions
verzögert die Oxidation und ermöglicht längere und heißere Profile. Stickstoff überträgt Wärme besser als Luft, daher können die Sollwerte niedriger sein
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options?page=1
. Solder Nozzle Cleaning Removes oxidation residues and re-tins the nozzle surface without overspray of machine or printed circuit board eliminating contamination
| http://etasmt.com/cc?ID=te_news_bulletin,23572&url=_print
solder film and the base metal is not exposed. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB
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, the more seriously will the solder paste be splashed during gasification, so the more easily tin sweats are formed. At the same time, the higher the temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23573.chtml
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| https://www.eptac.com/faqs/ask-helena-leo/ask/charring-of-wire-insulation
. If the insulation is stripped during the stripping operation, the problem can be destroying the solderability of the wire, where it will not solder or, cannot be tinned, due to the oxidation on the wire strands
| http://etasmt.com/te_news_bulletin/2021-08-31/23573.chtml
. Process and design-related causes: • Solder paste flux not aggressive enough for level of oxidation present on part or PCB • PCB pad contaminated
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder can prevent solder powder from melting together well, thus forming tin sweats. But, this phenomenon can be controlled effectively by using proper preheat
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder can prevent solder powder from melting together well, thus forming tin sweats. But, this phenomenon can be controlled effectively by using proper preheat
