ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-wins-vision-and-em-award-103ild
. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any
| http://etasmt.com/cc?ID=te_news_bulletin,20761&url=_print
. The components on the various boards used in our computers are soldered to the circuit board through this process. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during welding, and the manufacturing cost is easier to control
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-exhibit-advanced-selective-soldering-technology-at-the-2019-smta-guadalajara-expo
. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/news/nordson-select-to-showcase-advanced-selective-soldering-software
. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any
| http://etasmt.com/te_news_industry/2021-09-01/24564.chtml
. Dewetting directly impacts the quality of solder joints. Root Cause Analysis The PCB pads or the component‘s pins are oxidized. An oxidation layer prevents contact between the solder and the surface plating layer
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/select/about/news/nordson-select-to-exhibit-advanced-selective-soldering-technology-at-the-2019-smta-guadalajara-expo
. This exceptional solder nozzle tinning system keeps the solder nozzles prestigiously clean by automatically removing oxidation residues and re-tinning the surface of the solder nozzles without any
Heller Industries Inc. | https://hellerindustries.com/dewetting/
thin solder film and the base metal is not exposed. Process and design-related causes of PCB Dewetting: Solder paste flux not aggressive enough for level of oxidation present on part or PCB PCB pad contaminated Component lead contaminated Excessive moisture absorbed by paste Paste exposed beyond
| http://etasmt.com/cc?ID=te_news_industry,4361&url=_print
reflow Oven Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead free solder flow resistance, wettability is not as good as lead solder, especially when the circuit board pad processed with OSP (organic protective film bare copper
| http://etasmt.com/cc?ID=te_news_industry,24165&url=_print
>> SMT Technical Nitrogen Protection Reflow Oven Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead-free solder flow resistance, wettability is not as good as lead solder, especially when the circuit board pad processed with OSP
| http://etasmt.com/te_news_industry/2021-09-01/24568.chtml
. Some Print Circuit board components is very small, easy to be oxidated in the high temperature environment, so need the nitrogen process to avoid oxidation on the solder surface
