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forms a tornado-funnel shaped stirring action, and it can stir, soften and de-foam the solder paste with appropriate viscosity. Solder paste has good wet-ability
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PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/new-2016-solder-joint-goals_topic1921.html
: IPC-7351B Concave and Rectangular End Cap (Chip) lead-forms each only have 2 options for Toe, Heel and Side solder joints, regardless of the Chip Array pin pitch range from 0.80 mm to