Heller Industries Inc. | https://hellerindustries.com/tombstoning/
: Improper pad design Improper pad trace Improper solder mask application Via in pad draining solder from connection Trace with solder mask over it running under component causing a fulcrum effect on
Heller Industries Inc. | https://hellerindustries.com/bit_publications/the-last-will-and-testament-of-the-bga-void/
× The Last Will And Testament of the BGA Void. Post navigation Previous Post Previous The Effect of Vacuum Reflow Processing On Solder Joint Voiding And Thermal Fatigue Reliability
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura
Heller 公司 | http://hellerindustries.com.cn/00600-248.pdf
? In fact, a nitrogen atmosphere in the oven does improve reflow results. It creates solder joints that are shinier, improves wetting angles and increases the “margin for error” in the process
Heller Industries Inc. | https://hellerindustries.com/component-cracking/
Component Cracking Home » Component Cracking Re-printed in partnership with ITM Component Cracking Cracking of multilayer ceramic capacitors has been attributed to excessive heating rates during reflow
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Abstract 19-2 A STUDY OF THE FAILURE MECHANISMS IN LEAD-FREE AND EUTECTIC TIN-LEAD SOLDER BUMPS FOR FLIP CHIP ASSEMBLY Julia Y. Zhao, David Mackessy, and John Jackson Abstract 19-2 EFFECT OF AGING ON PULL STRENGTH OF SnPb, SnAgCu, AND MIXED SOLDER JOINTS IN
| https://www.smtfactory.com/What-is-the-working-process-of-Full-auto-SMT-Stencil-Printer-id40272477.html
⑧ The stencil is aligned with the PCB, the Z-frame will move upward, and the PCB touches the lower part of the stencil ⑨ Once moved into place, the squeegee will push the solder paste to roll on the stencil and print it on the PCB's PAD position through the holes in the stencil. ⑩ When the
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/last-will-of-bga-void.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/last-will-of-bga-void-1.pdf
: IPC Solder Products Value Council (SPVC), “The Effect of Voiding in Solder Interconnections Formed from Lead-free Solder Pastes with Alloys of Tin, Silver and Copper” [6
| https://www.smtfactory.com/I-C-T-V5000H-SMT-On-line-Automated-Optical-Inspection-AOI-Machine-for-SMT-Line-pd49400944.html
+Telecentric lens The high component solder joint inspection is not affected as no shadow effect in the entire field of view. Entire FOV Assist Position High detection ability on no exposed pad components(BGA,etc
