18 solder that obscures the stress relief bend of through-hole components results

Partner Websites: solder that obscures the stress relief bend of through-hole components (Page 1 of 2)

Accept or Reject: Solder Contacting Component Bodies | EPTAC

| https://www.eptac.com/soldertips/accept-or-reject-solder-contacting-component-bodies/

. The reason being is that if the solder does touch the body it will reduce or eliminate the stress relief characteristic of the leads, which can cause physical component damage and failures, either

19 EWS Questions of July .PPT [Read-Only]

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_07_15_09.pdf

. 8 Component Stress Relief #2  Solder in the lead bend area of a lead attached to a terminal, does it affect the Stress relief requirements of the component

Are Voids in Solder Joints Really an Issue?

| https://www.eptac.com/blog/are-voids-in-solder-joints-really-an-issue

. It has been shown that voids are stress relievers within the solder joint, implying that they provide the solder joints with some stress relief and they

Accept or Reject: Solder Contacting Component Bodies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/accept-or-reject-solder-contacting-component-bodies/

. The reason being is that if the solder does touch the body it will reduce or eliminate the stress relief characteristic of the leads, which can cause physical component damage and failures, either

Accept or Reject: Solder Contacting Component Bodies - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/accept-or-reject-solder-contacting-component-bodies

. The reason being is that if the solder does touch the body it will reduce or eliminate the stress relief characteristic of the leads, which can cause physical component damage and failures, either

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

EXPERIMENT-BASED COMPUTATIONAL INVESTIGATION OF THERMOMECHANICAL STRESSES IN FLIP CHIP BGA USING THE ATC4.2 TEST VEHICLE David W. Peterson Abstract 1999 12-4 REFLOW SOLDERING OF THROUGH-HOLE COMPONENTS Phil Zarrow Abstract 12-4 NEW GENERATION METALLIC

Surface Mount Technology Association (SMTA)

Are Voids in Solder Joints Really an Issue? - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/are-voids-in-solder-joints-really-an-issue/

. It has been shown that voids are stress relievers within the solder joint, implying that they provide the solder joints with some stress relief and they

J-STD-001E-2010: 4.5.1, Gold Removal Issues - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues

? Have you experienced RF component manufacturers that only offer SMT components with gold finish before? Does the concern of gold embrittlement take into account how much solder paste is being deposited in a surface mount solder joint? Answer

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/co_website/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

and form leads of axial electrical components up to a maximum rate of 25,000 parts per hour. Components are fed into the machine and then the component's leads are trimmed by carbide cutting blades, and crimped and/or cut in a manner that avoids stress

GPD Global

CF8 Documentation Package

GPD Global | https://www.gpd-global.com/pdf/lead-former/CF8-Doc-Package-801-1-01.pdf

and form leads of axial electrical components up to a maximum rate of 25,000 parts per hour. Components are fed into the machine and then the component's leads are trimmed by carbide cutting blades, and crimped and/or cut in a manner that avoids stress

GPD Global

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