244 solder tinning results

. –  From the surfaces to be soldered of solder terminals plated with 2.54 µm [100 µin] or more of gold thickness. –  A double tinning process or dynamic solder wave may be used for gold removal prior to soldering the component on or in the assembly, either Surface Mount or Plated Through Hole components 2 The Criteria J-STD-001 ES 4.5.1 Gold Removal

| https://www.eptac.com/wp-content/uploads/2012/09/eptac_10_17_12.pdf

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103IL, and the compact Novo ® 300. The Integra ® 103ILD is a dual pot selective soldering system and features Nordson SELECT’s unique automatic solder nozzle tinning system

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