Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
—User-Friendly Software with Multiple Control Points Results: DBC at Heat Sink Exhibit 7—No Vacuum vs. Vacuum on Heat Sink (<1% voids) Results: Automotive QFN Exhibit 8
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
Chip Scale Package 0540 CSP Delamination 0543 CSP Voids 0657 CSP Die Attach Delamination, Through Transmission Flip Chip 0354 Flip Chip - Disbonded solder bumps and halo defects 0355 Flip Chip Heat Sink Attach1016Flip Chip Underfill Void and Solder Bump Defects 2271 Flip Chip Underfill Void2466Flip Chip Underfill Multiple Voids Hybrid
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
Cleaning Ning-Cheng Lee, Ph.D. Abstract 23-1 Reliability Study and AF Modeling for SnAgCu Solder Joints and SnPb Solder Joints in QFN Packages Dong Hyun Kim, Mudasir Ahmad, Sue Teng Abstract 23-1 Second Generation Pb-Free Alloys Randy Schueller, Ph.D
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