Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5246
The Role of Nickel in Solder Alloys - Part 2. The Effect of Ni on the Integrity of the Interfacial Intermetallic in Sn-Based/Cu Substrate Solder Joints 中文
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/about-nordson-yestech/articles/how-dynalab-switched-to-aoi
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. Nordson YESTECH AOI inline and offline/benchtop systems offer high-speed PCB inspection with exceptional defect coverage. Inspecting solder joints and verifying correct part assembly quickly and accurately enables users to improve quality on the fly and increase throughput
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/automated-optical-inspection-systems?con=t&page=27
. Nordson YESTECH AOI inline and offline/benchtop systems offer high-speed PCB inspection with exceptional defect coverage. Inspecting solder joints and verifying correct part assembly quickly and accurately enables users to improve quality on the fly and increase throughput
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/automated-optical-inspection-systems?con=t&page=30
. Nordson YESTECH AOI inline and offline/benchtop systems offer high-speed PCB inspection with exceptional defect coverage. Inspecting solder joints and verifying correct part assembly quickly and accurately enables users to improve quality on the fly and increase throughput
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/automated-optical-inspection-systems?con=t&page=31
. Nordson YESTECH AOI inline and offline/benchtop systems offer high-speed PCB inspection with exceptional defect coverage. Inspecting solder joints and verifying correct part assembly quickly and accurately enables users to improve quality on the fly and increase throughput
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/yestech/products/solder-paste-inspection?con=t
Paste Inspection Equipment The FX-500 ULTRA 3D SPI provides 3D height, volume and area metrology for PCB boards with complex and small pad sizes where solder volume definition is critical for joint reliability
