| https://www.eptac.com/blog/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal
2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
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| http://etasmt.com/te_news_bulletin/2013-03-05/2761.chtml
. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems
| http://etasmt.com:9060/te_news_bulletin/2013-03-05/2761.chtml
. Whether for power electronics, electronic aviation systems, medical equipment or electronic systems for the automotive industry, voids in solder joints represent one of the main problems
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| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
2.54 μm [100 μin] or more of gold thickness. A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.smtfactory.com/news/Semi-auto-SMT-Production-Line.html
& Place Machine Feeder & Nozzle DIP Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine Belt Assembly Line PCB Handling Machine Loaders
