| https://www.eptac.com/faqs/ask-helena-leo/ask/silver-immersion-finish-boards
. Baking will impact the solderability of the board, especially if they are as stated immersion silver boards. My recommendation is to assemble a board, bake it for at least 8 hours and process it through the wave solder process
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. Drawbridging See Tombstoning . E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Drawbridging See Tombstoning . E ENIG Surface finishing process of electroless nickel followed by immersion gold. During soldering the gold is dissolved into the solder joint
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth
? Review the depth of the board in the wave. Try running the board at least ½ of the board thickness in the wave to use the hydrostatic pressure of the wave to push the solder up into the plated through holes
| https://www.eptac.com/soldertip/soldertip-36-wave-soldering-insufficient-fill-and-voids-in-pth/
? Review the depth of the board in the wave. Try running the board at least ½ of the board thickness in the wave to use the hydrostatic pressure of the wave to push the solder up into the plated through holes
| https://www.eptac.com/faqs/ask-helena-leo/ask/what-is-the-correct-way-to-fill-solder-cups
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
] or more of gold thickness A double tinning process or dynamic solder wave may be used for gold removal prior to mounting the component on the assembly
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/events/introductory-selective-soldering-workshop-november-2018
. Manual Soldering Selective vs. Wave Soldering AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards Contact Us Global Sales
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/about/events/introductory-selective-soldering-workshop-october-2018
. Manual Soldering Selective vs. Wave Soldering AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards Contact Us Global Sales
