ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/products/solder-paste
. Our batch-to-batch consistency helps reduce defects and eliminate the need for rework. FluxPlus™ Paste Flux Formulated to work with any alloy and heating process, Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/solder-paste-and-soldering-equipment
. Nordson SELECT FluxPlus™ Paste Flux Formulated to work with any alloy and heating process, Nordson EFD’s FluxPlus is perfect for BGA rework, mobile device repair, reflowing solder paste, and more
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. Also, low solder volume can cause solder defects. Is the stencil designed for the PIP process? To get enough paste to fill up the pin hole, the stencil aperture must be designed bigger than the solder pad size depending upon the paste volume calculation
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. Also, low solder volume can cause solder defects. Is the stencil designed for the PIP process? To get enough paste to fill up the pin hole, the stencil aperture must be designed bigger than the solder pad size depending upon the paste volume calculation
