Imagineering, Inc. | https://www.pcbnet.com/blog/identifying-and-correcting-solder-bridge-defects/
. Thus, it is critical that solder bridge defects are caught early in the manufacturing process so that time and money are not wasted
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/bullet-and-mini-wave-solder-nozzle
Barcode Reader Soldering Processes Process Troubleshooting Guide Application Centers Selective vs. Manual Soldering Selective vs. Wave Soldering Selective Soldering Workshops AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/75-mm-wave-nozzle
Barcode Reader Soldering Processes Process Troubleshooting Guide Application Centers Selective vs. Manual Soldering Selective vs. Wave Soldering Selective Soldering Workshops AOI Solder Joint Inspection X-Ray Solder Joint Inspection Support Service Service and Spare Parts Literature Library About Us Profile News Events Awards
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Heller Industries Inc. | https://hellerindustries.com/wicking-defects/
& Articles White Papers & Technical Articles Videos THERMAL PROCESS SOLUTIONS Reflow Soldering Solutions Causes & Defects – Reflow Soldering Solder Ball Defects Insufficient Solder Wicking Defects Tombstoning PCB Soldering PCB Bridging Defects PCB Dewetting PCB Nonwetting Circuit Board Voids Intermetallic Growth on PCB
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1st Place Machinery Inc. | http://www.firstplacemachinery.com/first_place_smt_pcb_wave_solder_ersa.html
: 42013 066 Year 2001-2002 Type: Wave Soldering Machine Left to Right Process Flow LEAD FREE - Ready to Run ERSA Spray Flux System 3 Medium Wave Preheaters Double Wave Solder Module Solder level control Solder bar feederg Conveyor
Heller Industries Inc. | https://hellerindustries.com/bridging-defects/
. Process and design-related causes of PCB Bridging Defects: Excessive volume of solder due to improper pad dimension Excessive volume of solder due to improper stencil aperture Improper application of solder mask Excessive slump of solder paste Reflow-related causes
