| http://etasmt.com/te_news_industry/2021-08-31/23964.chtml
– ramp up too fast Same as soldering ball. Poor wetting – ramp up too slow Solder paste is oxidizing if the pre-heat too long. Pre-heat and soak zone (from 150°C to 180°C
| https://www.eptac.com/faqs/ask-helena-leo/ask/soldering-thick-pcbs-with-3-oz-copper
. In the solder tip, it was mentioned to preheat the board. Another avenue would be to place the board on a heat plate or above a preheater while it is being soldered as this would help in getting the board up to temperature prior to soldering
| https://www.smtfactory.com/What-is-an-LED-Flip-Chip-id3680601.html
Home Company Company Profile I.C.T Team Global Partners SMT Line-Up SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Reflow Oven Lyra Series Reflow Oven S Series Reflow Oven L Series Reflow Oven LV
| https://www.smtfactory.com/LED-Flip-Chip-id3680601.html
& Place Machine PANASONIC Pick & Place Machine FUJI Pick & Place Machine I.C.T Pick & Place Machine Wave Soldering Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine PCB Handling Machine Loaders
| https://www.smtfactory.com/Introduction-of-Lyra-Reflow-Oven-s-process-development-stage-id3093448.html
I.C.T Team Global Partners SMT Line-Up SMT Production Line Full-auto SMT Line Semi-auto SMT Line Reflow Oven Pyxis Series Reflow Oven Lyra Series Reflow Oven S Series Reflow Oven L Series Reflow Oven LV
| https://www.smtfactory.com/I-C-T-LV733-LV-Series-Vacuum-Reflow-Oven-Machine-pd44543571.html
. Flow speeds in the upper and lower heat zones can be separately controlled, assuring that your PCB is heated up. Saddle profile The component is brought to a temperature of at least 240 °C for soldering
| https://www.smtfactory.com/Introduction-to-the-working-principle-of-Lyra-Reflow-Oven-id45852477.html
. Give enough time in this area to make the temperature of the larger component catch up with the smaller component, and to ensure that the flux in the Lyra Reflow Oven solder paste is fully volatilized
| https://www.eptac.com/soldertip/gold-removal-issues-with-hollow-cup-connectors/
. Are there other methods we could explore? Answer: I understand your methodology is loosening the pins which is a result of the softening up the plastic housing from excessive heat