46877 | https://www.nordson.com/zh-CN/divisions/dage/test-types/ball-shear-solder-ball-shear?con=t&page=7
ASYMTEK Products | Nordson Electronics Solutions
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=1
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Cold Bump Pull Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cavity-shear?con=t
. Shear testing is in accordance with: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 - Solder Ball Shear The patented Nordson DAGE cavity shear test methodology overcomes passivation interference and removes the maximum amount of material which is difficult to achieve using a traditional chisel style loadtool
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=2
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Cold Bump Pull Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cavity-shear?con=t&page=2
. Shear testing is in accordance with: JEDEC JESD22-B116 - Au Ball Shear JEDEC JESD22-B117 - Solder Ball Shear The patented Nordson DAGE cavity shear test methodology overcomes passivation interference and removes the maximum amount of material which is difficult to achieve using a traditional chisel style loadtool
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types-2020/cold-bump-pull
vertically remove the solder ball from a device or substrate by using patented tweezer jaws. Tests are performed in accordance with: JEDEC JESD22-B115 JEITA EIAJ ET-7407 IPC-9708 The cold bump pull jaws have a cavity etched into it to match as closely as possible to the diameter of the solder ball being tested
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/bump-shear?con=t&page=1
) for use in the production test environment to remove the solder ball from a device or substrate. This methodology is well suited to test small geometry components with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/cold-bump-pull?con=t&page=10
Contact Global HQ Africa Asia Central and South America Europe USA and Canada Cold Bump Pull Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/about/news/nordson-dage-announces-further-orders-for-its-unique-patented-hot-pin-pull-test-method
) reports that several leading manufacturers of complex multi-layer printed circuit boards have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and printed circuit boards in accordance with the industry standard IPC9708
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/bump-shear?con=t
) for use in the production test environment to remove the solder ball from a device or substrate. This methodology is well suited to test small geometry components with
