21 solderability, dewetting, pictures results

Partner Websites: solderability

•  Joint quality is dependent on solderability •  The basic principle of soldering is for the solder to bond to the base material. •  Substrate must be fully and rapidly wetted by the tin in the solder being applied

| https://www.eptac.com/wp-content/uploads/2012/10/eptac_11_14_12.pdf

Shelf Life of Soldered Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components

: There has been some request by our customers asking how long products can be stored before solderability becomes a concern. Assuming the following storing conditions, Humidity-10-70% Temperature 12-30C

Shelf Life of Soldered Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/shelf-life-of-soldered-components/

  Two reasons product does not solder   Oxidized intermetallic coating   Exposed intermetallic surfaces   Contamination of the surfaces to be soldered 10 Specification Wetting Requirements for Class 3 Products 11 Types of Solderability Defects 12 Poor Wetting And Its Causes

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_06_16_10.pdf

Webinars - EPTAC - Train. Work Smarter. Succeed (5)

| https://www.eptac.com/webinars/page/5

” for electronics assembly and handling. Learn More Understanding Solderability Testing for Printed Circuit Boards and Components Length

: Qualification Specifications  IPC/EIA J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires.  J-STD-003, Solderability Tests for Printed Boards. 9 Flux Performance

| https://www.eptac.com/wp-content/uploads/2007/10/webinar_eptac_10_17_07.pdf

: Qualification Specifications  IPC/EIA J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals, and Wires.  J-STD-003, Solderability Tests for Printed Boards. 9 Flux Performance

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_10_17_07.pdf

Solder Ball Defects - Heller

Heller Industries Inc. | https://hellerindustries.com/solder-balls-defects/

(overlapping solder mask) Misaligned solder mask (overlapping solder pad and print area) Flux is too weak for the oxidation level of the board and/or components Components have marginal solderability

Heller Industries Inc.