Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5101
Moisture Effects in Common Solderable RF Connector Dielectrics Part II: Characterization of Damage Threshold Moisture Level for Moisture/Reflow Sensitive Polymers 中文
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/blog/012419-halogens-and-halides-consider-halogen-free-flux-and-solder-paste
. A consequence is that many do not wet as well and have a smaller profile process window. Component lead solderability has a greater effect on joint quality
| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
| https://www.eptac.com/faqs/soldertips/soldertip/solder-paste-shelf-life-and-testing
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
Surface Mount Technology Association (SMTA) | https://www.smta.org/education/presentations/presentations.cfm
Cost of Gold, Copper, Palladium, Silver, tin etc Protective coatings and effects of soldering operations Solderability reflow wetting patterns Solderability tests: Dip and inspect, wetting balance, rotary dip test Simple
Surface Mount Technology Association (SMTA) | https://www.smta.org/webinars/
, tin etc Protective coatings and effects of soldering operations Solderability reflow wetting patterns Solderability tests: Dip and inspect, wetting balance, rotary dip test Simple production reflow test methods and
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
: Whisker Inspection Results André M. Delhaise, Stephan Meschter, Polina Snugovsky, Jeff Kennedy, Zohreh Bagheri Abstract 32-2 Warpage of Flexible-Board Assemblies with BGAs During Reflow and Post-Assembly Usage Pradeep Lall, Kartik
| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf
Surface Mount Technology Association (SMTA) | https://www.smta.org/training/smt-process-for-students.cfm
. These videos are provided with the generous support of Cisco Systems, Inc. Solder Paste Printing Paneling and Handling Pick and Place Chip Placement Fiducials Reflow Wave Soldering Depanelization Upcoming Events June 23 Webinar
