| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
. I’ve copied the abstract for your information, complements and copyright of IEEE: “…The focus of this work is the tin oxide characteristics and their influence on solderability
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
, David Braun Abstract 22-2 EFFECTS OF STORAGE PROCEDURES AND BAKE OUT ON THE SOLDERABILITY OF IMMERSION SILVER-COATED PRINTED CIRCUIT BOARDS Paul Vianco, et al. Abstract 22-1 A CASE STUDY FOR TRANSITIONING CLASS A SERVER MOTHERBOARDS TO LEAD-FREE R
Surface Mount Technology Association (SMTA) | https://www.smta.org/hutchins/hutchins.cfm
? Senior Process Technology Development Engineer, Intel ATTD 2008 Lei Nie, Ph.D. , CALCE @ University of Maryland (College Park, MD) Paper: "Reliability of Reballed and Reworked Plastic Ball Grid Arrays in SnPb and SAC Assembly Process" Where is she now
Surface Mount Technology Association (SMTA) | https://www.smta.org/harsh/tech2018.cfm
+ Improved die attach alloys that achieve high reliability in power electronic devices exposed to harsh environments are needed. Suresh Telu will present the use of micro-alloying additives that modify bulk allow properties, solderability and solder joint strength
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Solderability Matrix Finish RMA RA WS NC High activity WS Aluminum Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. Solderability Matrix Finish RMA RA WS NC High activity WS Aluminum Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel
: Can a PTH component (resistor, fuse, or solid wire) be reliably soldered in-line with stranded wire? Similarly to a wire lap joint, but with a component between the two wires
Heller 公司 | http://hellerindustries.com.cn/Vacuum-Void-Reduction-Reflow.pdf
] but inspecting area arrays intrinsically is difficult and quantifying void content can be equally challenging. The review of solder joint voiding by Aspandiar is a benchmark for discussion on this subject [3
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
] but inspecting area arrays intrinsically is difficult and quantifying void content can be equally challenging. The review of solder joint voiding by Aspandiar is a benchmark for discussion on this subject [3
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
] but inspecting area arrays intrinsically is difficult and quantifying void content can be equally challenging. The review of solder joint voiding by Aspandiar is a benchmark for discussion on this subject [3
