Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes 中文 MEMBERS LOGIN Membership Become a Member
| https://www.eptac.com/faqs/ask-helena-leo/ask/shelf-life-of-soldered-components
. 1.1 Scope This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires
| https://www.eptac.com/ask/shelf-life-of-soldered-components/
. 1.1 Scope This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/about-us/standards/ipc-j
– Solderability Test for Printed Boards (Lötbarkeitsprüfung für Leiterplatten) J-STD-004 – General Requirements and Test Methods for Soldering Fluxes
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/about-us/standards/ipc-j
) Guidelines for the following J-Standards to guarantee customer satisfaction include: J-STD-003 – Solderability Test for Printed Boards J-STD-004
| https://www.eptac.com/soldertips/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/efd/about-us/standards/ipc-j
(Institute for Interconnecting and Packaging Electronic Circuits) para os seguintes Padrões J a fim de garantir a satisfação do cliente: J-STD-003 – Solderability Test for Printed Boards
| https://www.eptac.com/soldertip/solder-paste-shelf-life-and-testing/
. The adverse affect would be un-reflowed solder paste, insufficient reflow, solder balls, dewetting, etc. The recommendations would be to perform a solderability test, slump test and flux activity test on the solder paste itself and see if it still performs to the original standards of the material
