ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-selection-guide
. Solderability Matrix Finish RMA RA WS NC High activity WS Aluminum Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-selection-guide
. Solderability Matrix Finish RMA RA WS NC High activity WS Aluminum Beryllium Copper Brass Bronze Cadmium Chromium Non-solderable Copper Galvanized Steel Gold Kovar Magnesium Non-solderable Mild Steel
| https://www.eptac.com/wp-content/uploads/2013/09/eptac_09_18_13.pdf
Surface Mount Technology Association (SMTA) | https://www.smta.org/icsr/speaker_forms/Paper-Format-Requirements.doc
side reflow Ensure a robust surface finish that remains solderable after 2 heat cycles. In circuit test strain limits could be larger with thicker boards. ICT stress must be minimal to prevent BGA fracture Ensure low contact resistance on test points
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
. Both the heat spreader and the back side of the die must have an adherent, solderable surface. The component reliability depends on the life of both these transition interfaces and of the solder
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