| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process. Can you tell me if there are any specific issues related to vapor phase soldering to immersion tin plated pads on... Question
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
: I have a customer who seems to be having issues making acceptable solder connections using the vapor phase process. Can you tell me if there are any specific issues related to vapor phase soldering to immersion tin plated pads on relatively thick multilayer PCBs
| https://www.eptac.com/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering/
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-gold-removal-and-wave-soldering-vs-hand-soldering
”. Does this mean that if we run a through-hole CCA thru a wave solder machine twice it would meet the gold removal requirements? If not, how would we tin the gold plated components by wave soldering? Answer
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/soldertips/soldertip-46-open-connections-found-on-bga-components/
SolderTip #46: Open Connections Found on BGA Components | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/soldertips/soldertip-48-the-cleanliness-of-wire-and-terminal-connections/
SolderTip #48: The Cleanliness of Wire and Terminal Connections | EPTAC Skip to content Scroll Toll Free: 800.643.7822 Toggle navigation Training All Classes
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
SolderTip #46: Open Connections Found on BGA Components - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-48-the-cleanliness-of-wire-and-terminal-connections
SolderTip #48: The Cleanliness of Wire and Terminal Connections - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
