ORION Industries | http://orionindustries.com/pdfs/qpad2.pdf
. It is designed for those applications where maximum heat transfer is needed and electrical insulation is not required. Q-Pad II is the ideal thermal interface material to replace messy thermal grease compounds
| https://www.eptac.com/soldertips/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. I would suggest two items to consider. One is to review the artwork to determine the metal load on each pad. Secondly, review the thermal profile for the particular product being processed to verify the proper temperatures were met during the reflow cycle
Heller Industries Inc. | https://hellerindustries.com/thermal/
Curing Applications Low Void Curing SW and Automation Videos & Articles White Papers & Technical Articles Videos Thermal Process Solutions Reflow Soldering Solutions Causes & Defects
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/thermal-compounds?con=t&page=36
: Thermal Compounds prf49470B Nordson Corporation What is Paint? Industrial Coating Systems Application Issues for Spray-Applied Liquid UV Coatings Industrial Coating Systems Controlled Chemical Plasma Etching for Advanced Technology Applications Nordson MARCH
| https://www.eptac.com/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2/
. I would suggest two items to consider. One is to review the artwork to determine the metal load on each pad. Secondly, review the thermal profile for the particular product being processed to verify the proper temperatures were met during the reflow cycle
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-issues-with-incomplete-solder-reflow-in-production-2
. I would suggest two items to consider. One is to review the artwork to determine the metal load on each pad. Secondly, review the thermal profile for the particular product being processed to verify the proper temperatures were met during the reflow cycle
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001e-2010-4-5-1-gold-removal-issues
: This is a new application for components where there is a bottom pad for either thermal relief or electrical functionality. The ability to tin these pads with the proper solder alloy could impact the coplanarity of the device when it is assembled to the printed board
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-in-pads-using-fp-designer_topic1540.html
:08pm I'm trying to build a through-hole part using the FP Designer, and the pad stacks it creates do not have thermal reliefs. Is there something special I have to do to accomplish this
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-in-pads-using-fp-designer_topic1540_post7192.html
. Is there a setting somewhere to enable thermal pad generation? Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/thermal-relief-in-pads-using-fp-designer_topic1540_post7193.html
. Is there a setting somewhere to enable thermal pad generation? Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined
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