| https://www.eptac.com/faqs/soldertips/soldertip/issues-of-burnt-flux-on-class-3-pcb-assemblies
won’t hurt or degrade the product if left on the boards after soldering. Fully active fluxes, if left behind, are susceptible to the absorption of moisture which is a problem when the product is in the field as the flux residues are still active and when moisture is
| https://www.eptac.com/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces/
: Wave Soldering Insufficient Fill and Voids in PTH SolderTip #37: Through Hole Soldering of Thick PCBs SolderTip #38: Clean vs No-Clean Fluxes SolderTip #39
| https://www.smtfactory.com/What-Tests-are-Required-for-a-Qualified-Reflow-Oven-Before-it-Shipped-to-The-Customer-id3385161.html
& Place Machine Feeder & Nozzle DIP Machine Acrab Series W Series Automatic Insertion Machine Selective Wave Soldering Machine Belt Assembly Line PCB Handling Machine Loaders
| https://www.eptac.com/faqs/ask-helena-leo/ask/j-std-001f-4-5-1-gold-removal-class-2-requirement-changed
: The reasoning for the change was due to the failures happening in the field with these types of components. The members in attendance were responding to a request from a user who had evidence to show that this was occurring and was a problem, so the committee voted to change the criteria from a Process
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| https://www.eptac.com/faqs/ask-helena-leo/ask/multiple-wash-steps-affecting-resistance-characteristics
. I would also tend to think that the fluxes from the soldering operation could also impact the resistive element, whereas instead of impacting the functionality of the resistive element it remains on
| https://www.eptac.com/faqs/soldertips/soldertip/soldertip-46-open-connections-found-on-bga-components
. We have experimented with many minor adjustments, yet this occasional problem continues. Do you have any suggestions? Answer: Based upon the warp and twist characteristics of the printed board laminate materials and the BGA, this could be a […] Question
| https://www.eptac.com/blog/eptac-corporation-releases-first-interactive-pcb-hands-on-inspection-lab
. The students will learn how to find the problem areas on the assemblies with a focus on improving product yields. They will learn how to improve their discrimination through the power of observation
| https://www.eptac.com/faqs/ask-helena-leo/ask/solder-selection-for-printed-circuit-boards-and-terminals
. The alloys of SAC 305 and Sn100C will work together so mixing of those two should not be a problem. The concern, however; is the flux and can it be removed after the replacement of the component
| https://unisoft-cim.com/installation-troubleshooting.html
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