ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/advanced-technology-solutions/semiconductor
. Plating and lithography techniques can be used during front end manufacture to build bump and pillar structures. In addition, solder balls may also be placed or printed and then reflowed during back end manufacture before wafer dicing
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/best_papers.cfm
. The Effect of Ni on The Integrity of The Interfacial Intermetallic in Sn-Based Solder Joints to Copper Substrates ." (Co-authors: Keith Sweatman and Tetsuro Nishimura
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