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Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=4798
. Many of the industry standard test vehicles are dated and not representative of current electrical and electronic assemblies. The purpose of this research is to use a non-standard test board with sensors placed at the bottom termination to study cleanliness and contamination effects under QFN components
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2020/02/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Void-Reduction-Warpage-Vacuum-Reflow-Soldering.pdf
) of the system while still achieving the void rate reduction < 1%. Another key capability that will be explored is the elimination of solder splatter during the process of vacuum purge down
| http://etasmt.com/cc?ID=te_news_bulletin,23578&url=_print
% total void area Reflow time under a vacuum of 15 seconds was able to achieve <1% total void area specification All pressures tested < 20 Torr met <1
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23578.chtml
% total void area Reflow time under a vacuum of 15 seconds was able to achieve <1% total void area specification All pressures tested < 20 Torr met <1
| http://etasmt.com/te_news_bulletin/2021-08-31/23578.chtml
% total void area Reflow time under a vacuum of 15 seconds was able to achieve <1% total void area specification All pressures tested < 20 Torr met <1
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
. Additional QFN components currently are under test and those results will be reported at a future date. Finite element analysis (FEA) has been incorporated into the program to aid in correlating the relationship between the package attributes, PCB properties and thickness, and cycles to failure in each of the test profiles. Key Words
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