53 stain on enig results

IPC Specifications, Related Questions and Interpretations Question #1 Existing Condition: •  ENIG SMT pads on a flex circuit, pads use teardrop layout and the component size is 0603

| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf

IPC Specifications, Related Questions and Interpretations Question #1 Existing Condition: •  ENIG SMT pads on a flex circuit, pads use teardrop layout and the component size is 0603

| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf

Poron Cellular Urethane Foams Industrial Materials

ORION Industries | http://orionindustries.com/pdfs/PORONURETHANE.pdf

■ High internal strength and dimensional stability ■ Chemical resistance PORON industrial materials are produced on a “make to order” basis. Although off-the-shelf stock may be available for standard grades and thicknesses, normal lead time is two weeks

ORION Industries

 Drop test failures are either vias cracking or clean interfacial separation at the solder to PCB interface  All the units failing with the same failure mode on ENIG boards

| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_12_17_08.pdf

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/ask-helena-leo/ask/failing-to-remove-gold-plating-in-final-assembly

board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating

PCB Assembly Tolerances | Imagineering

Imagineering, Inc. | https://www.pcbnet.com/capabilities/assembly/tolerances/

. They provide enough variation for us to assemble your board – and for it to work properly in your application. Supported PC Board Specs: Min size:  1.967 in. X 1.967 in. Max size:  19.67 in. X 19.67 in. Min thickness:  4 mil Max thickness:  240 mil Layer Count:  Up to 24 Finishes:  HASL, ENIG, Silver

Imagineering, Inc.

Failing to Remove Gold Plating in Final Assembly - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/ask/failing-to-remove-gold-plating-in-final-assembly/

board’s acceptance in final assembly? Answer: The gold plating on boards is typically an ENIG coating, which is Electroless Nickell, Immersion Gold plating

Online PCB Auction – October 7 – 14, 2014 Hosted By Go-Dove and BAJA Bid (Featuring Items From Cirte

Baja Bid | https://bajabid.com/online-pcb-auction-october-7-14-2014-hosted-go-dove-baja-bid-featuring-items-cirtech-electronics/

. The catalog is being regularly updated so buyers are encouraged to review the list of items on a periodic basis. The following is a short list of the items included in this event. • ENIG Line

Baja Bid

Solder Paste Archives - PCBASupplies

| https://pcbasupplies.com/solder-paste/

& Place Nozzles Clearance Solder Products Brands Thermaltronics XDry Corp Count On Tools Quantum Storage Systems PCBASupplies BEAU TECH EasyBraid Tronex Koki Categories Hand Soldering

0.47 7 Atmospheric - 7.64 8 5 15 0.48 Test #7 Details-No Vacuum Test #1 w/ 5 Torr for 30 seconds 0.21% worst case voids Results Stencil Design #2 1. QFN “MLF 100” of With Vacuum & Without Vacuum # Type 2 # without Vacuum # with Vacuum ( 5torr 60sec ) Results ENIG ( 20torr / 30sec ) ENIG ( 20torr / 60 sec

46969 | https://hellerindustries.com/wp-content/uploads/2018/07/Inline-Vacuum-Reflow-System.pdf

Heller Industries Inc.

46969