| https://www.eptac.com/j-std-001-revision-changes-regarding-the-requirements-for-gold-plating-removal/
had a partnership in products and components for many years. The initial reasoning behind the application of gold to printed circuit boards was to make them more susceptible to the application of wire bonding and for corrosion protection
| https://www.eptac.com/ask/gold-wire-bond-failing-pull-test/
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/faqs/ask-helena-leo/ask/gold-wire-bond-failing-pull-test
Gold Wire Bond Failing Pull Test - EPTAC - Train. Work Smarter. Succeed Looking for solder training standards, manuals, kits, and more
| https://www.eptac.com/ask/what-is-the-correct-way-to-fill-solder-cups/
. According to J-STD-001, 4.5.1 Gold Removal From at least 96& of the surfaces to be soldered of the through hole component leads with 2.54 um [100uin.} or more of gold thickness
: Why did the IPC make the gold removal requirement for Class 2 products a requirement (D2D3) when in Rev E of J-STD-001 it was a process indicator (P2D3
| https://www.eptac.com/wp-content/uploads/2021/11/webinar_eptac_05_19_10.pdf
4.3.2 9 610 Changes Added the following: 4.5.1 Wire routing, added defective conditions for wire damage 4.5.2 Table 4-1 for violation of minimum bend radius Section
| https://www.eptac.com/solder-tips/
: We all have from time to time had solder, be it in paste or wire form, sitting on shelves for what seems like years. I know there are all types of variables related to its
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
. Some typical brazing alloys include copper-zinc, copper-gold, copper-phosphorous, and silver-based alloys. The melting temperatures for brazing alloys range from 450° C (852° F) to 1100° C (2012° F
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