ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/products/selective-soldering-systems?con=t&page=8
Sheet_English Nordson SELECT Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components Nordson SELECT Bob Klenke (Circuitnet, November 2019
| http://etasmt.com/cc?ID=te_news_bulletin,9561&url=_print
many through-hole components are still manufactured. Some SMDs can be soldered with a temperature-controlled manual soldering iron, but unfortunately, those that are very small or have too fine a lead pitch are impossible to manually solder without
| http://etasmt.com:9060/te_news_bulletin/2021-09-02/24962.chtml
& MARS Reflow Oven SMT Reflow Oven Reflow Soldering Machine Customization Reflow Oven IR/ UV Curing Oven Video SMT Line - Customer Factory PCB Handling Machine SMT Stencil Printer Pick and Place
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/advice-for-solder-mask-paste-mask-layers_topic484_page1.html
. Another example is fine pitch BGA part pads need to be solder mask defined to secure the pad to the board to pass drop tests. It has been proven that during drop tests a BGA solder joint will survive better than the pad ripping off the PCB surface because the pad size is so small
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic484&OB=ASC.html
. These are for example: 1. Solder mask defined pads under fine pitch BGA packages. 2. Multiple separated squares on the paste mask layer to create 50
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/advice-for-solder-mask-paste-mask-layers_topic484.html
. Another example is fine pitch BGA part pads need to be solder mask defined to secure the pad to the board to pass drop tests. It has been proven that during drop tests a BGA solder joint will survive better than the pad ripping off the PCB surface because the pad size is so small
| http://etasmt.com/te_news_bulletin/2019-08-12/9561.chtml
many through-hole components are still manufactured. Some SMDs can be soldered with a temperature-controlled manual soldering iron, but unfortunately, those that are very small or have too fine a lead pitch are impossible to manually solder without
| https://www.smtfactory.com/Regarding-the-adjustment-methods-and-development-trends-of-Semi-auto-SMT-Production-Line-id49852477.html
mobile phones, which further drives the Semi-auto SMT Production Line surface mount The miniaturization of components and the high-density of product assembly, 0201 components, CSP, flipchip and other small and fine-pitch devices have also
Lewis & Clark | https://www.lewis-clark.com/shop/page/4/
: 13.5″ x 22″ Smallest Component Capacity: 0201 Components Largest Component Size: 1.96″ Square Body Placement Accuracy: ±0.001″ (0.025mm) Max Placement Rate: 3000 cph Fine Pitch Capability
| https://www.smtfactory.com/How-to-Choose-Insertion-Machine-for-PCB-Assembly-id48428727.html
. • Increased flexibility: Insertion machines can be used to place a wide variety of components, which can give manufacturers more flexibility in their design process. • Improved quality
