| http://etasmt.com:9060/te_news_industry/2013-05-06/4361.chtml
from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and
| http://etasmt.com/te_news_industry/2013-04-28/4161.chtml
lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and equipment improve the quality and yield of the reflow soldering. Nitrogen reflow has become the
| http://etasmt.com/te_news_industry/2013-05-06/4361.chtml
from oxidizing in the welding, It plays a significant improving effect to improve the weldability of lead-free solder. With the improvement of the packing density and fine pitch (Fine pitch) assembly technologies ,the nitrogen reflow process and
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/footprint-land-pattern-naming-convention_topic29_post1963.html
: 152 Post Options Post Reply Quote Mattylad Report Post Thanks(0) Quote Reply Posted: 05 Oct 2012 at 12:58pm I find that components always need to be created in mm, however for track/gap spacings, track widths etc thou is fine and there are no problems. Using mils (or thou as we use
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-land-pattern-naming-convention_topic29_post1969.html
and ALL the speakers from ALL the manufacturer's speak and teach in Mil Units. I love to hear them teach PCB designers how to solve complex metric fine pitch BGA solutions using Mil Units
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-land-pattern-naming-convention_topic29_page1.html
: 152 Post Options Post Reply Quote Mattylad Report Post Thanks(0) Quote Reply Posted: 05 Oct 2012 at 12:58pm I find that components always need to be created in mm, however for track/gap spacings, track widths etc thou is fine and there are no problems. Using mils (or thou as we use
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-land-pattern-naming-convention_topic29_post1986.html
and ALL the speakers from ALL the manufacturer's speak and teach in Mil Units. I love to hear them teach PCB designers how to solve complex metric fine pitch BGA solutions using Mil Units
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/footprint-land-pattern-naming-convention_topic29&OB=DESC_page1.html
: 152 Post Options Post Reply Quote Mattylad Report Post Thanks(0) Quote Reply Posted: 05 Oct 2012 at 12:58pm I find that components always need to be created in mm, however for track/gap spacings, track widths etc thou is fine and there are no problems. Using mils (or thou as we use
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic29&OB=DESC.html
: 152 Post Options Post Reply Quote Mattylad Report Post Thanks(0) Quote Reply Posted: 05 Oct 2012 at 12:58pm I find that components always need to be created in mm, however for track/gap spacings, track widths etc thou is fine and there are no problems. Using mils (or thou as we use
Lewis & Clark | http://www.lewis-clark.com/product-tag/mydata/
Shared Databases HYDRA Z High Speed HYDRA High Speed Autoteach Linescan for Z Line Mode Fast Place Sequence HYDRA Large Component Range HYDRA Fine Pitch Proactive Replenishment Monitor Condition: Complete
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