ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-seal-bonding-systems
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/aerospace
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/electronics-semiconductor
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/energy
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/medical-life-science-and-pharmaceutical
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/soldering
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating
, size up to 300 x 200 mm. C-Slide with touchscreen C-Slide Desktop System for Heat Seal Bonding, ACF Laminating, Hot Bar Reflow Soldering and Heat Staking, handles the product in a pneumatic slide of two or three positions (max. 150 mm stroke), with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/industries/electronics-assembly-and-packaging?con=t&page=4
in a pneumatic slide of two or three positions (max. 150 mm stroke), with… Heat Staking Systems Nordson DIMA Heat Staking is a pulsed heat process to join two or more parts, of which one is at least made out of plastic
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/products/pelletizers?con=t&page=37
V-T Feedblock from Nordson Is Adjustable On-Line and Is Available with Larger than Usual Channel Widths to Reduce Shear Stress and Interfacial Instability Much Greater Lip-adjusting 'Stroke' of New
