| http://etasmt.com/cc?ID=te_news_industry,26961&url=_print
. And our epoxy resin and BT are all organic materials. 2. Inorganic materials: ① Aluminum substrate: The aluminum substrate is a metal-based copper clad laminate with good heat dissipation function
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/electronics-assembly-and-packaging?con=t&page=10
- Application Note 540 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309 DELAMINATIONS
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=10
: Test and Inspection DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309
| https://www.feedersupplier.com/sale-13005432-dek-horizon-03ix-smt-stencil-printer-screen-printing-machine.html
. Width Adjustment Programmable motorized rear rail Transport Direction Left to right Right to left Left to left Right to right Substrate Handling size (min) 50mm (X)x40.5mm (Y
| http://www.feedersupplier.com/sale-13005432-dek-horizon-03ix-smt-stencil-printer-screen-printing-machine.html
. Width Adjustment Programmable motorized rear rail Transport Direction Left to right Right to left Left to left Right to right Substrate Handling size (min) 50mm (X)x40.5mm (Y
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0540-csp-delaminations
- Application Note 540 Massive delamination shown in red. Sample & Method In this CSP the die is mounted to an elastomer material, which is then attached to a flex substrate with solder balls
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes
) 3D Acoustic Microscope Image 2518 QFN Lead Delaminations 2535 PBGA Substrate Delaminations 2566 TQFP Die Surface Delaminations Flex Circuit 0053 Flex Circuit Delaminations
KingFei SMT Tech | https://www.smtspare-parts.com/sale-40803078-momentum-btb-printing-machine-mpm-speedline-solder-paste-printer.html
Maximum substrate size: (X 609.6mmx508mm x Y) (24x20 inches) Minimum substrate size: (Kx50.8mm x 50.8mm) (2x2 inches) Substrate thickness size: 0.2~5.0 mm (0.008~0.20 inches
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications
. In this bonding process, flex or other parts are aligned with great accuracy to match the traces on the substrate that need bonding
FKN Systek | http://fknsystek.com/K3000.htm
. These can be used to singulate standard FR4 PCBs and aluminum substrate panels used in the lighting industry. The K3000L can be used to singulate metal substrate panels up to 24" long . Specifications
