ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/hot-bump-pull?con=t
DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
ASCEN Technology | https://www.ascen.ltd/Products/PCB_depaneling_machine/169.html
copper substrate,LED T8 tube etc,and avoid the Tedious Send Enquiry Download brochure Product Details Application: This Aluminum PCB separator with the automatic width adjustment function and cutting the LED aluminum PCB board by 6 cutting wheel
Imagineering, Inc. | https://www.pcbnet.com/blog/what-are-aluminum-printed-circuit-boards-used-for/
. Unlike standard PCBs, which typically use a FR-4 fiberglass substrate, aluminum PCBs are made using a metal substrate primarily comprised of aluminum alloy
Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/
) is the range in which a PCB substrate becomes softened and deforms when reaching extreme heat. In this state, the material will revert back to its original shape once it has cooled
| https://pcbasupplies.com/solder-stations-1/
by adjusting the power instantaneously, thereby meeting the exact requirements of the substrate component and solder material. Can be... MSRP: Now: $230.00 Add to Cart Quick view Thermaltronics
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=2
Bonding The bonding products of Nordson DIMA are Hot Bar Bonding Systems. In this bonding process, flex or other parts are aligned with great accuracy to match the traces on the substrate that need bonding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t&page=2
) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems
. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t
Bonding The bonding products of Nordson DIMA are Hot Bar Bonding Systems. In this bonding process, flex or other parts are aligned with great accuracy to match the traces on the substrate that need bonding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t
) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
