ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1016-voids-and-bond-defects
through the substrate side. Gating was on the interface between the cured underfill and the substrate, and includes the bonding of the solder balls to their pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1011-pbga-delaminations
. Gating was on the interface between the molding compound and the substrate. Result The two packages at top have no significant internal defects
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0245-pbga-popcorn-crack
) was imaged from the top side. Gating of the return echoes was at the interface between the molding compound and substrate. Result The large red area is a “popcorn crack
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/0904-delaminations
Delaminations - Application Note 904 Sample & Method In the image the echoes from the ultrasonic transducer were gated on the interface between the solar cell die attach and the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/1009-pbga-delaminations
. Result All four BGA packages have very similar large circular defects. These defects are likely delaminations at the molding compound to substrate level and/or within the substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2543-medical-delaminations
. The electrodes are insulated from each other by plastic structures (gray). Acoustic imaging was performed through a plastic layer bonded to a substrate in which channels have been formed for the electrodes
| https://www.smtfactory.com/LED-Flip-Chip-id3680601.html
: 0 Author:Site Editor Publish Time: 2021-01-15 Origin: Site Industry Introduction LED flip chip refers to the chip that can be directly bonded with ceramic substrate without welding wire. We call it DA chip
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/your-process/fluid-types/underfill
. Offering non-contact jetting systems for underfill dispensing with precision fluid placement. What is Underfill? Underfill is an epoxy material that fills gaps between a chip and its carrier or a finished package and the PCB substrate
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
GPD Global | https://www.gpd-global.com/co_website/fluid-dispense-adhesive-application.php
; typically ceramic, gold, and FR4 substrates. It makes the electrical and adhesive connection between device and electrical pad and substrate
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