ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/lighting-and-led?con=t&page=9
540 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309 DELAMINATIONS Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=10
147 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN Plastic BGA - MC to Substrate Delamination - Application Note 2596 PBGA POPCORN CRACKS Nordson SONOSCAN PBGA Popcorn Crack, Through Transmission
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/industries/medical-life-science-and-pharmaceutical?con=t&page=9
540 DELAMINATIONS IN SUBSTRATE Nordson SONOSCAN PBGA MC to Substrate Delamination - Application Note 2600 TSOP DIE CRACKS Nordson SONOSCAN TSOP Die Cracks - Application Note 309 DELAMINATIONS Nordson
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/applications/test-and-inspection?con=t&page=9
SURFACE DELAMINATIONS Nordson SONOSCAN TQFP Die Surface Delaminations - Application Note 2566 CSP DELAMINATIONS Nordson SONOSCAN CSP Delamination - Application Note 540 DELAMINATIONS IN SUBSTRATE Nordson
1st Place Machinery Inc. | http://www.firstplacemachinery.com/smt_pcb_dispensers_mrsi.html
& surface mapping MRSI vision system Automatic substrate & pattern alignment Verification alignment Sub-global parameters Price: $15,000 MRSI Automatic Dispensing System See more photos below
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/bonding?con=t&page=3
Bonding The bonding products of Nordson DIMA are Hot Bar Bonding Systems. In this bonding process, flex or other parts are aligned with great accuracy to match the traces on the substrate that need bonding
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/bump-shear?con=t&page=1
) for use in the production test environment to remove the solder ball from a device or substrate. This methodology is well suited to test small geometry components with
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=6
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/die-shear?con=t&page=1
the tool above the substrate. Testing is similar to standard ball shear tests and is performed in accordance with: MIL STD 883 Low profile die shear testing is required when the die under test are very thin and their height profile is low relative to the surface that they are bonded to
Imagineering, Inc. | https://www.pcbnet.com/resources/page/6/
. Errors in printed circuit board manufacturing not only produce malfunctioning boards… Read More Jun 16 Which PCB Substrate Should I Use
