ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=4
. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
Imagineering, Inc. | https://www.pcbnet.com/blog/dissolving-barriers-how-water-soluble-printed-circuit-boards-could-solve-e-waste/
. Soluboard is a revolutionary new PCB substrate material that is dissolvable in water. This property will be easier to dispose of and can even lead to reusing electronic components recovered from old boards. We’ve authored
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=1
. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t
. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-max.php
). Secure the product during processing with vacuum. Board crowders push substrate (product) against fixed rails and are standard work table support
GPD Global | https://www.gpd-global.com/fluiddispense-prod-max.php
). Secure the product during processing with vacuum. Board crowders push substrate (product) against fixed rails and are standard work table support
GPD Global | https://www.gpd-global.com/high-precision-dispenser.php
). Secure the product during processing with vacuum. Board crowders push substrate (product) against fixed rails and are standard work table support
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/bump-shear?con=t
) for use in the production test environment to remove the solder ball from a device or substrate. This methodology is well suited to test small geometry components with
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. These sheets are electrically isolated from each other with a layer of non-conductive substrate. PCBs are faster and easier to fabricate than earlier mass-producing circuits since fabricators can mount and wire components in a single operation
| https://pcbasupplies.com/tmt-2000s/
requirements of the substrate component and solder material. Curie Heat Technology operating at 470KHz. Maximum flexibility, allows the use of K, P and S Series tips
