ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/heat-seal-bonding-systems?con=t&page=3
. Flex or other parts can be aligned with great accuracy to match the traces on the substrate or other parts that need bonding. More temperature, time and pressure are applied and cause plastic deformation of the adhesive material and compression of the particles
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/processes/acf-laminating-systems?con=t&page=3
. Prior to laminating (or pre-tacking) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t
Nordson DAGE Semiconductor Nordson DAGE Cold Bump Pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/applications/laminating?con=t&page=3
) the ACF to the substrate, the ACF tape is pre-cut at the required length from the ACF reel. Cutting is done using the half-cut method where only the actual ACF material is cut, the cover-layer is used for tape transport
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=1
Nordson DAGE Semiconductor Nordson DAGE Cold Bump Pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
Imagineering, Inc. | https://www.pcbnet.com/blog/category/blog/page/4/
. Errors in printed circuit board manufacturing not only produce malfunctioning boards… Read More Jun 16 Which PCB Substrate Should I Use
Imagineering, Inc. | https://www.pcbnet.com/blog/category/industry-news/page/5/
begin your search Close Search Category Industry News Jun 16 Which PCB Substrate Should I Use? By Behind the Work Blog , Industry News What is the best PCB substrate for your next printed circuit board project
ASCEN Technology | https://www.ascen.ltd/Products/custom_automatic_machine/pcb_cutting_mach/360.html
. Shear stress is reduced to the minimum, suitable for long strip aluminum substrate, LED light strip separating Description: 1, PCB cutting tool body is made of aluminum alloy, which does not occupy space, and is easy to operate and fast speed
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dima/products/bonding-and-soldering-systems/c-tack
: applying the adhesive material to the substrate. After that the final Heat Seal Bonding process can take place. Before the ACF is applied to the substrate, the ACF tape is half-cut at the required length from a reel of ACF
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/wedge-shear?con=t&page=5
… Cold Bump Pull Nordson DAGE Nordson DAGE bondtesters provide cold bump pull tests to vertically remove the solder ball from a device or substrate by using patented tweezer jaws
