Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Vacuum-Fluxless-Reflow-Technology-for-Fine-Pitch.pdf
. Results showed that with different oxide removal agents, the agent activity had a significant impact on solder dimensional cliff. Gas formic acid has higher surface tension compared to regular reflow fluxes, providing the benefit of higher tolerance for solder wicking
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/technical-experts/2d-x-ray-inspection
identification of broken tracks in multilayer boards. This technique is not restricted to surface layers which means that the thickness of buried tracks can also be measured. Such measurements cannot be made using standard profilometry methods. Figure 8
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resources/solder-dictionary-of-terms
). F Fillet Solder formation at the intersection of surfaces of a solder connection. Fine Pitch Centerline spacing of leads 0.5 mm (20 mils) or less. Flux A material that cleans metal surfaces of absorbed gases, oxide films, and other surface contaminants
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Journal of SMT Articles The Journal of Surface Mount Technology is a quarterly, peer-reviewed journal featuring jury-selected technical papers
| http://etasmt.com/cc?ID=te_news_industry,24163&url=_print
, the more seriously will the solder paste be splashed during gasification, so the more easily tin sweats are formed. At the same time, the higher the temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder
| http://etasmt.com:9060/te_news_industry/2021-09-01/24163.chtml
temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder can prevent solder powder from melting together well, thus forming tin sweats. But, this phenomenon can be controlled effectively by using proper preheat
| http://etasmt.com/te_news_industry/2021-09-01/24163.chtml
temperature is, the faster the solder oxidation will be. The oxide film on the surface of solder powder can prevent solder powder from melting together well, thus forming tin sweats. But, this phenomenon can be controlled effectively by using proper preheat
| http://www.thebranfordgroup.com/dnn3/Auction/MULA0623.aspx
: Glenbrook Technologies RTX-113HV X-Ray System Hitachi X-Strata 920 X-Ray Coating Thickness Measurement System (2018) Oxford Instruments CMI 760 CU Tester w/ Wise FlatStar 650 Planerizer Optek V-Series Video Inspection
| 1 |
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
