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| https://www.eptac.com/faqs/ask-helena-leo/ask/vapor-phase-soldering-to-immersion-tin-plated-pads
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
| https://www.eptac.com/ask/vapor-phase-soldering-to-immersion-tin-plated-pads/
%3D4684411 Although the temperature of the vapor phase material is high enough, the problem appears to be the tin oxide on the surface of the board which is preventing the reflow of the solder
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,” In this paper, typical plasma applications for WLP, such as improving Cu-PI interface adhesion, increasing the PI surface roughness, reducing the current leakage in WLP, the oxide removal from bump
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