| https://www.smtfactory.com/How-to-replace-the-chip-capacitor-of-the-SAMSUNG-Pick-Place-Machine-id3532139.html
& Place Machine 's chip capacitor identification rules are partly similar to chip resistors. The difference is that the surface of the chip resistor will have parameter identification, but the surface of the chip capacitor does not have any parameter identification
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/75-mm-wave-nozzle
ControlFlow Solder Nozzles Drop-Jet Fluxing Full Surface Preheating In-Process Flux Verification Microdrop Flux Dispenser Parallel Double Selective Soldering PhotoScan Software Solder Nozzle Cleaning Spray Fluxing SWAK-OS
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/select/technologies-or-options/dual-solder-nozzles
ControlFlow Solder Nozzles Drop-Jet Fluxing Full Surface Preheating In-Process Flux Verification Microdrop Flux Dispenser Parallel Double Selective Soldering PhotoScan Software Solder Nozzle Cleaning Spray Fluxing SWAK-OS
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/our-company/news-room/news-releases/value-plastics-improves-material-transfer-with-new-bag-port-technology
material described below: Animal derivative-free qualification USP Class VI certification Guaranteed heat sealing and conformance with polyethylene bags 24-hour resistance to alcohol stress cracking
GPD Global | https://www.gpd-global.com/co_website/fluiddispense-prod-dispensetech.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/fluiddispense-prod-dispensetech.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
GPD Global | https://www.gpd-global.com/dispense-pumps.php
& Fill / Glob Top Encapsulation Hot Melt LED Encapsulation Solder Mask Solder Paste Surface Mount Adhesive Thermal Interface Material Trench Filling Underfill UV Curing Wafer Processing OTHER
| http://etasmt.com/te_news_bulletin/2020-09-12/19161.chtml
; Third, the monthly maintenance content of reflow soldering: Monthly heating wire test for reflow soldering Test the furnace temperature, including the heating time, the temperature difference at the sampling point, the resistance value of the heating wire, etc. 4
| http://etasmt.com/cc?ID=te_news_industry,4361&url=_print
reflow Oven Lead-free era makes whether need nitrogen in reflow a hot topic . As the lead free solder flow resistance, wettability is not as good as lead solder, especially when the circuit board pad processed with OSP (organic protective film bare copper
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/front-end-components?con=t&page=7
. Plus, you can be certain our components match your front-end process since they are made to OEM specifications with enhanced resistance to wear
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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Phone: 952-920-7682
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