Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-usa/?cpn=1
0.007", Green LPI Mask, White Top Silkscreen, Individual board. If your job requires more than 4 layers, faster turnaorond, Gold, Cutouts/Slots, Internal Routing, Multiple Parts, Step
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255
. One example of how the interactions between solder and surface finish can affect solder joint integrity is the potential formation of brittle gold/tin intermetallic compounds (IMCs
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=0
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=5
* Materials FR4(130Tg) FR4(170Tg) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/
. This order can only be placed thru our website. Jobs not meeting the above specs will be requoted . Other Options: If your job requires Gold, Cutouts/Slots, Internal Routing, Multiple Parts, Step
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=2
) Copper Weight 1 oz 2 oz 3 oz 4 oz Finish Plating HASL (Leaded) LF HASL Immersion Gold Immersion Silver White Tin OSP Minimum Trace/Space 0.005" 0.006" 0.007
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote/?cpn=1
. If your job requires more than 4 layers, faster turnaorond, Gold, Cutouts/Slots, Internal Routing, Multiple Parts, Step & Repeat, Scoring, Tab
Imagineering, Inc. | https://www.pcbnet.com/quote/board-quote-china/?cpn=1
0.007", Green LPI Mask, White Top Silkscreen, Individual board. If your job requires more than 4 layers, faster turnaorond, Gold, Cutouts/Slots, Internal Routing, Multiple Parts, Step
| https://www.eptac.com/soldertips/soldertips-solderability-issues-with-nickle-plated-surfaces/
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
Imagineering, Inc. | https://www.pcbnet.com/blog/understanding-the-pcb-fabrication-process-from-design-to-delivery/
. For example, electroless nickel immersion gold (ENIG) is a common surface finish due to its long shelf life and RoHS compliance . However, it’s more expensive than other options
