| https://www.eptac.com/wp-content/uploads/2016/08/eptac_08_17_16.pdf
| https://www.eptac.com/wp-content/uploads/2021/11/eptac_08_17_16.pdf
| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-solderability-issues-with-nickle-plated-surfaces
. They will re-tin with flux, but reappear following steam-aging. Is this something you have encountered before? Answer: There is a metallurgy issue with soldering to nickel plated surfaces and depending upon the thickness of the final tin/lead coating, the steam aging will penetrate the finish coating and create a
| http://etasmt.com/cc?ID=te_news_bulletin,23575&url=_print
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=10
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
| https://www.eptac.com/faqs/ask-helena-leo/page/8
... Read More J-STD-001E-2010: 4.5.1, Gold Removal Issues QUESTION Question: Since we are seeing more and more components with gold finish on the solder attachment pads
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=11
Contact Global HQ Africa Asia Central and South America Europe USA and Canada First Bond Ball/Stud Bump Pull Copper is increasingly replacing gold as the interconnect material for wire bonds, stud
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. Surface Finish A surface finish is then applied to the exposed copper traces and pads. This enhances solderability, prevents oxidation, and improves the overall reliability of the PCB
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
INNOVATIONS FOR ADVANCED MEDICAL ELECTRONIC APPLICATIONS Vern Solberg Abstract 21-2 EFFECTS OF STORAGE ENVIRONMENTS ON THE SOLDERABILITY OF NICKEL-PALLADIUM-GOLD FINISH WITH Pb-BASED AND Pb-FREE SOLDERS Edwin Lopez, Paul Vianco, Samuel Lucero, and Carly
| http://etasmt.com:9060/te_news_bulletin/2021-08-31/23575.chtml
. During reflow, with the addition of tin-lead solders, the intermetallic grows. With other board metal finishes, other metallics form, such as AuSn when soldering components to boards with gold-flash finish (and tin-lead solder
