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: Robert Darveaux, Amkor Technology "Mechanical Testing of Solder Joint Arrays Versus Bulk Solder Specimens" 2005: Julia Y. Zhao, Analog Devices "A Study of the Failure Mechanisms in Lead-free and Eutectic Tin-lead Solder Bumps for Flip Chip Assembly" 2004
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| https://www.eptac.com/press/eptac-corporation-becomes-exclusive-training-center-for-idea-counterfeit-training-programs/
,” commented Mark Pilkington, President of EPTAC. “We have enjoyed working with Debra and her group in the development and delivery of these programs as we focus to reduce the impact of this growing industrial issue
| https://www.eptac.com/press/eptac-corporation-hires-brian-downes-as-director-of-business-development/
’ program offerings, products, services and locations. “We are very pleased to bring Brian onboard,” commented Mark Pilkington, President of EPTAC Corporation
| https://www.eptac.com/press/robert-heckman-honored-by-the-ipc-for-fiber-optics-standard/
– Leo Lambert, Vice President and Technical Director at EPTAC Corporation has been given the highest IPC Honor, The Raymond E. Prichard Hall of Fame Award for his extraordinary contributions to the electronics industry and the IPC
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| https://www.smtfactory.com/I-C-T-SMT-Technology-Empowers-the-Future-of-the-Semiconductor-Industry-id67514027.html
: Semiconductor sensors are used to detect and measure environmental parameters such as temperature, humidity, and pressure, and are used in automatic control and smart devices. 4. Power devices
