Imagineering, Inc. | https://www.pcbnet.com/blog/how-to-prevent-a-solder-ball-defect/
. Humidity – Moisture has increasingly become one of the biggest issues for printed circuit board manufacturers today. Aside from the popcorn effect and microscopic cracking, it can also cause solder balls to form due to escaping air or water
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/pan_APEX06.pdf
. Hence, an optimum combination of peak temperature and time above liquidus is important to achieve a good solder joint. The purpose of this experiment is to study the effect of the reflow peak temperature and time above liquidus on solder joint shear force
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/pan_APEX06-1.pdf
. Hence, an optimum combination of peak temperature and time above liquidus is important to achieve a good solder joint. The purpose of this experiment is to study the effect of the reflow peak temperature and time above liquidus on solder joint shear force
Blackfox Training Institute, LLC | https://www.blackfox.com/4-common-errors-in-smt-assembly/
. During the printing process, a smeared solder paste on the bottom of the stencil can also lead to solder balls forming. Like solder bridging, the first immediate solution is to reduce the humidity and moisture in the facility
Surface Mount Technology Association (SMTA) | https://www.smta.org/smtai/courses.cfm
year’s syllabus will continue to include defect troubleshooting, stencil troubleshooting, and nanocoatings, with briefer sections on under wiping and automated solder paste inspection, and new sections on
Blackfox Training Institute, LLC | https://www.blackfox.com/soldering/4-common-errors-in-smt-assembly/
. During the printing process, a smeared solder paste on the bottom of the stencil can also lead to solder balls forming. Like solder bridging, the first immediate solution is to reduce the humidity and moisture in the facility
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200622100619
Surface Mount Technology Association (SMTA)
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
. Abstract 28-4 Assessment of the Effect Of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure Pradeep Lall, Ph.D., and Kazi Mirza Abstract 28-3 Non-destructive Evaluation of Solder Ball Quality under
ASCEN Technology | https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/505.html
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