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Posted: 11 Feb 2015 at 7:46pm Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side
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Posted: 11 Feb 2015 at 7:46pm Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side
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Posted: 11 Feb 2015 at 7:46pm Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side
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: 5377 Post Options Post Reply Quote Tom H Report Post Thanks(2) Quote Reply Posted: 11 Feb 2015 at 7:46pm Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side
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: 5377 Post Options Post Reply Quote Tom H Report Post Thanks(2) Quote Reply Posted: 11 Feb 2015 at 7:46pm Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side
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: 5404 Post Options Post Reply Quote Tom H Report Post Thanks(2) Quote Reply Posted: 11 Feb 2015 at 7:46pm Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side
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? Possible to send the contact please. Many thanks. Best Regards,NB. Blind Via With Smaller Solder Mask Opening : All vias under BGA's need... Author: Tom HSubject: 1110Posted: 18 Sep 2013 at 7:04pmAll vias under BGA's need to be "Tented" with solder mask to prevent solder bridging under the component
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/blind-via-with-smaller-solder-mask-opening_topic1110.html
with small solder mask opening. The drill for this blind via is 0.1mm, pad is 0.3mm and the solder mask opening is 0.2mm. These vias are under the BGA
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: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5182 Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 18 Sep 2013 at 7:04pm All vias under BGA's need to be "Tented" with solder mask to prevent solder bridging under the component
