12 termination capacitor results

VOIDS AND DELAMINATIONS

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/sonoscan/support/application-notes/2083-voids-and-delaminations

Capacitor Acoustic Microscope Image and Cross-Section - Application Note 2083 Sample & Method A set of five multilayer ceramic chip capacitors were imaged on the C-SAM instrument using a 50 MHz

ASYMTEK Products | Nordson Electronics Solutions

– Printed Circuit Boards Types of Capacitor Failures 3 4 Induced Crack Defects Two major causes of Capacitor cracking • Mechanical • Thermal 5 Flex Testing1 Test Samples Industry Standard Capacitor Bend Test 6 SnAgCu Flex Crack Examples 7 SnAgCu Flex Crack Examples 8 SnAgCu

| https://www.eptac.com/wp-content/uploads/2014/09/eptac_09_17_14.pdf

SolderTips: Problems With Stress Cracks in Ceramic Components | EPTAC

| https://www.eptac.com/soldertips/problems-with-stress-cracks-in-ceramic-components/

. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor

8.3 SMT Connections, page 8-7, paragraph 5, “… Components with surfaces and /or termination ends or sides that are not wettable by design are exempt for solder wetting requirements in those areas

| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components/

. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor

SolderTips: Problems With Stress Cracks in Ceramic Components - EPTAC - Train. Work Smarter. Succeed

| https://www.eptac.com/faqs/soldertips/soldertip/soldertips-problems-with-stress-cracks-in-ceramic-components

. There is lots of talk these days about using hot air to reflow the caps as the thermal ramp up with the solder iron is too quick and will potentially crack the end termination from the body of the capacitor

Legend & Assembly Polarity Marking - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/topic2593&OB=DESC.html

. Bottom only termination packages – BGA, LGA, CGA, QFN, PQFN, SON, PSON and DFN The polarity marking size should match the Terminal Width

PCB Libraries, Inc.

Legend & Assembly Polarity Marking - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2593&OB=ASC.html

. Bottom only termination packages – BGA, LGA, CGA, QFN, PQFN, SON, PSON and DFN The polarity marking size should match the Terminal Width

PCB Libraries, Inc.

Legend & Assembly Polarity Marking - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2593&OB=DESC.html

. Bottom only termination packages – BGA, LGA, CGA, QFN, PQFN, SON, PSON and DFN The polarity marking size should match the Terminal Width

PCB Libraries, Inc.

Microsoft Word - Footprint Expert Surface Mount Families

PCB Libraries, Inc. | http://www.pcblibraries.com/Products/FPX/UserGuide/download/Footprint%20Expert%20Surface%20Mount%20Families.pdf

/downloads    http://www.PCBLibraries.com/forum  updated 5‐20‐22          Note: The Land Pattern images are shown in the Nominal Density Level  Non‐polarized Rectangular Chip Components  Chip Capacitor     Chip Resistor    Chip Inductor    Chip Varistor

PCB Libraries, Inc.