PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10599.html
(but not the only one) is high-power Chinese LED's with low-information datasheets. Absent a recommendation from the manufacturer, how do I decide whether a particular pad should have reduced solder paste, either through window-pane or simply shrinking the paste mask, and if it
PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/when-should-a-pad-use-windowpane-paste-mask_topic2600_post10602.html
(but not the only one) is high-power Chinese LED's with low-information datasheets. Absent a recommendation from the manufacturer, how do I decide whether a particular pad should have reduced solder paste, either through window-pane or simply shrinking the paste mask, and if it
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic2600&OB=ASC.html
(but not the only one) is high-power Chinese LED's with low-information datasheets. Absent a recommendation from the manufacturer, how do I decide whether a particular pad should have reduced solder paste, either through window-pane or simply shrinking the paste mask, and if it
| https://www.smtfactory.com/High-Speed-SMT-AOI-Machine-in-PCB-Board-Off-Line-Model-I-C-T-V8-pd48670624.html
+Telecentric lens The high component solder joint inspection is not affected as no shadow effect in the entire field of view. Entire FOV Assist Position High detection ability on no exposed pad components(BGA,etc
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/applications/test-and-inspection?page=2
& Product Lines ADVANCED TECHNOLOGY SOLUTIONS ● Nordson ELECTRONICS SOLUTIONS ◦ ASYMTEK Products ◦ MARCH Products ◦ SELECT Products ● Nordson EFD ● Nordson MEDICAL ● Nordson TEST & INSPECTION ◦ ACOUSTIC Products ◦ OPTICAL Products ◦ TEST Products ◦ Manual X-ray Products
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=8
. First bond ball pull utilises cold bump pull jaw technology to apply a vertical load (a pull test) to ball bonds and stud bumps. Ball shear tests can sometimes promote pad cratering due to the aggressive nature of the bonding process which can weaken the ball bonds
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=7
. First bond ball pull utilises cold bump pull jaw technology to apply a vertical load (a pull test) to ball bonds and stud bumps. Ball shear tests can sometimes promote pad cratering due to the aggressive nature of the bonding process which can weaken the ball bonds
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/dage/test-types/first-bond-ball-pull-stud-bump-pull?con=t&page=5
. First bond ball pull utilises cold bump pull jaw technology to apply a vertical load (a pull test) to ball bonds and stud bumps. Ball shear tests can sometimes promote pad cratering due to the aggressive nature of the bonding process which can weaken the ball bonds
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/topic3111&OB=ASC.html
. imagine a CAPC2020 extended 25% only for those 0.0001% and this happens in huge mass production. What more concerns is the extended required clearance around the pad due to 25
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/ipc7351-ipca610-side-overhang_topic3111.html
. imagine a CAPC2020 extended 25% only for those 0.0001% and this happens in huge mass production. What more concerns is the extended required clearance around the pad due to 25
