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| https://www.eptac.com/faqs/ask-helena-leo/ask/ipc-620-compliance-of-poke-home-junction-box
. The final product will be exposed to vibration and shock testing. Can you let us know if this would comply with the IPC-A-620 standard or not? Answer
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packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
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packaging and assembly applications protects the chip from moisture, ionic contaminants, radiation, and hostile operating environments such as thermal and mechanical conditions, shock, and vibration
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. As a result, plasma can perform numerous surface modification processes including surface activation, contamination removal, cross linking, etch by chemical reaction, and physical bombardment
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