ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-melt-quality-solutions
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/events/smta-michigan-expo-and-tech-forum-2016
. For example, RoHS requirements have driven printed circuit board assembly materials to ever higher temperature capabilities. The High Tg materials are designed to withstand the higher reflow temperatures of lead free solders but present their own set of problems down the line in subsequent manufacturing steps
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/polymer-processing-systems/information/xaloy-screw-recovery
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/new-flexvia-plus-plasma-treatment-system-to-process-flexible-electronic-substrates
and desmear process uniformity on both sides of the flex material. The desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials and other resins more effectively than traditional methods of etching and desmearing
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/about-us/news/nordson-march-wins-2015-new-product-introduction-award-for-its-flexvia-plus-plasma-treatment-system
. The high-performance desmear and etchback technologies remove epoxies, polyimides, high Tg blends, mixed materials, and other resins while the descum capabilities effectively remove resist residue
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/march/plasma-applications/pcb-manufacturing
. In contrast, plasma effectively removes epoxies, polyimides, high Tg blends, mixed materials, and other resins in standard and high aspect ratio panels
Blackfox Training Institute, LLC | https://www.blackfox.com/blog/4-key-attributes-that-pcbs-need-for-aerospace-deployment/
it’s internal or external temperatures. For this reason, PCB material selection must consider temperature. Those responsible for deciding on the circuit board material must make sure that no extreme heat or cold would be able to breach board critical temperature parameters like the glass transition temperature (Tg
Blackfox Training Institute, LLC | https://www.blackfox.com/4-key-attributes-that-pcbs-need-for-aerospace-deployment/
it’s internal or external temperatures. For this reason, PCB material selection must consider temperature. Those responsible for deciding on the circuit board material must make sure that no extreme heat or cold would be able to breach board critical temperature parameters like the glass transition temperature (Tg
| https://www.eptac.com/wp-content/uploads/2016/04/eptac_04_20_16.pdf
ORION Industries | http://orionindustries.com/pdfs/200mp.pdf
successful applications include: materials being bonded, dwell at RT before cold exposure and stress below the TG [i.e. expansion/ contraction stresses, impact]). Optimum conditions are: bonding high surface energy materials, longer time at RT before cold
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