Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2018/07/Vacuum-Void-Reduction-Reflow.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/04/Vacuum-Void-Reduction-Reflow-1.pdf
., Osaka, Japan 6Heraeus, Frankfurt, Germany 7Indium Corp., Clinton, NY, USA richard.coyle@nokia-bell-labs.com david.hillman@rockwellcollins.com ABSTRACT A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance
| http://etasmt.com/cc?ID=te_news_industry,3761&url=_print
. Since bulk of real-life solder joint failures are caused by the mismatch between the coefficients of thermal expansion between the component and the substrate, board level thermal cycling in air has
| http://etasmt.com:9060/te_news_industry/2013-04-05/3761.chtml
. Since bulk of real-life solder joint failures are caused by the mismatch between the coefficients of thermal expansion between the component and the substrate, board level thermal cycling in air has
| http://etasmt.com/te_news_industry/2013-04-05/3761.chtml
. Since bulk of real-life solder joint failures are caused by the mismatch between the coefficients of thermal expansion between the component and the substrate, board level thermal cycling in air has
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5476
: Solder joint voiding, vacuum reflow processing, thermal fatigue reliability, thermal cycling, lead-free alloys Members download articles for free: Log in now! Not a member yet
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms
. It occurs because of intermolecular forces between the liquid and surrounding solid surfaces. Cold Solder Joint A solder connection that was made with insufficient heat
| https://pcbasupplies.com/alloy-solder-paste-enig/
. That helps to prevent propagation of crack at the solder joint in thermal cycling. As found below, SB6NX shows much higher sheer strength than SAC305 with ENIG and OSP substrate alike
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5218
: SMTA International Abstract: The Pb-free solder joint attachment reliability of two Quad Flat No-Lead (QFN) packages with different body sizes and die to package ratios (DPR
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5052
. Statistical analysis was conducted to evaluate the efficacy of the thermal treatment on improving solder joint reliability. Physical failure analysis was also performed to investigate the evolution of the microstructure and determine the combined effects of the treatment and ATC on the failure mode. Key Words
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